Leading Card Manufacturer CPI Expands Contactless Portfolio with New Partnerships

Relationship with NXP Semiconductors and KSW Microtec Provides CPI Customers with
contactless payment applications optimized for the North American market

Littleton, Colo., (April 12, 2011) – CPI Card Group, a global leader in financial and commercial
card production and related services, today announced new initiatives with NXP Semiconductors
and KSW Microtec to broaden its portfolio of contactless offerings and provide customers with
expanded contactless technology solutions from two widely respected developers.

Demand for contactless cards in the financial payment card market has increased significantly
over the past several years. Given this new partnership and years of global experience, CPI now
offers additional qualified alternatives in the supply chain development of contactless payment
cards to meet the growing marketplace demands.

“In order to provide the best products for our customers, we feel it’s important to offer a variety
of technology choices and solutions from reliable partners in the industry,” says Benoit Guez,
director of Smart Cards and New Technologies at CPI. “Both NXP and KSW have demonstrated
their commitment to developing cutting-edge technologies in the contactless space, and we look
forward to working together as a team to meet our clients’ needs, and exceed their expectations.”
NXP Semiconductors offers a broad portfolio of solutions for banking applications, providing
customers with a combination of proven security and performance with their ICs. NXP’s Fast Pay
contactless security chip, deployed with CPI, can be widely used for contactless payment
applications and is specifically designed to provide consumers in the USA and Canada with a
secure, fast and comfortable payment experience. It’s embedded Data Encryption Standard
(DES) hardware co-processor and best-in-class contactless performance provides strong security
and fast transaction times.

KSW Microtec is a leading supplier of contactless prelaminates for ePayment, eGovernment and
Access Control applications. The KSW Thinlam®, a contactless prelaminate for card
manufacturers, provides exceptional thinness and maintains the highest reliability and durability
thanks to its unique assembly technology. Thinlam® is the ideal solution for any contactless
personal identification application especially where security, performance and appearance are
important.

"We are extremely pleased that CPI has selected NXP as a key technology partner for the US
banking market,” says Karsten Danziger, director of Banking Identification at NXP
Semiconductors. “Our proven Fast Pay solution will enable swift and secure payment
transactions. Working together with CPI and KSW we will create differentiating solutions that
enable the best possible customer contactless payment experience. NXP continues to raise the
bar with respect to the security, reliability, performance, and size of our contactless solutions.”

“We are delighted about the business partnership with our valued customer CPI. By combining
both our smart and innovative technologies, CPI and KSW establish new possibilities in card
manufacturing,” says Thomas Hitzer, CEO of KSW Microtec. “In cooperation with our partners,
we are committed to provide innovative, durable and secure RFID components, such as PVC
Thinlam® with NXP’s Fast Pay chip, for secure contactless card applications worldwide.”

About CPI Card Group
CPI, a global leader in financial, commercial and identification card production and related services, offers a single
source for plastic cards and other form factors, from foil cards and holograms to translucent and smart cards, and
personalization and fulfillment services. CPI offers the largest production capacity in North America. CPI's production
sites include Denver, Colorado; Fort Wayne, Indiana; Las Vegas, Nevada; Colchester, England; Liverpool, England;
and Toronto, Canada. CPI's plants in Colorado, Nevada, and Liverpool are ISO 9001 certified. For more information,
visit www.cpicardgroup.com.

About KSW Microtec
KSW Microtec AG founded in 1994, with its headquarters in Germany, is one of the world’s leading suppliers of
contactless components for applications such as Access Control and eGovernment, ePayment, eTicketing and AssetManagement. KSW combines successfully high-end wafer processing, extremely efficient assembly and lamination technology and far-reaching expertise in design. KSW has earned itself a leading position on the market as innovator and one of the most efficient, and simultaneously most flexible, producers of RFID components. KSW is an investment holding of the listed venture capital company Deutsche Effecten- und Wechsel-Beteiligungsgesellschaft AG headquartered in Jena. For more information visit: www.ksw-microtec.de